| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for enhancing light extraction efficiency and light use efficiency to materialize high-intensity brightness in a surface-mounted semiconductor light emitting device that mounts semiconductor light emitting elements on a package where a lead frame and a lamp house are formed together. <P>SOLUTION: Lead frames la and lb, on which a large number of semiconductor elements are mounted, are inserted and sealed in a metallic mold 5 as an insert, a multiple metallic mold 5 that takes multiple inserts, to form a sealed space 7 in the mold that includes a cavity 6 and an LED chip 2. Further, non-translucent resin with high reflectance is pressed and solidified in the cavity 6 that will become a molding material, and then, a molded object onto which semiconductor light emitting elements are mounted is taken out of the metallic mold 5, then going through the steps of sequential wire-bonding and sealing semiconductor light emitting elements and bonding wires using translucent resin to perfection. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
