| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a flexible printed circuit board capable of increasing the adhesion of both side plating and through hole plating and reliability in continuity. SOLUTION: Wet blast treatment, short-wave ultraviolet-ray treatment and activation treatment using an alkali metal hydroxide are sequentially applied on both surfaces of a polyimide resin film and the inner circumferential surface of the through hole, prior to electroless plating after the through hole for a through-hole plating is formed in the polyimide resin film. Electroless plating is applied to nickel or a nickel alloy to apply copper electroplating on the surface of the electroless plated layer. COPYRIGHT: (C)2006,JPO&NCIPI
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