| 摘要 |
PROBLEM TO BE SOLVED: To reduce man-hour for forming a circuit pattern and to form the circuit pattern with fine lines as well as fine pitches. SOLUTION: In order to form a circuit pattern 12 on a non-conductive substrate 11, aqueous paste or inorganic solvent paste diffusing metal particles whose average grain size is 200 nm or smaller in 0.001 to 80 wt.% is first applied over the non-conductive substrate 11 by maskless printing to form a coating film of a predetermined pattern. After the coating film is dried, the metal particles are then activated to form a thin film 13 comprised of metal particles. An electroless plating layer 14 is then deposited on the surface of the thin film by electroless plating with the metal particles forming the thin film 13 as a core. Further, an electrolytic plating layer 16 is deposited on the electroless plating layer 14 by electrolytic plating. COPYRIGHT: (C)2006,JPO&NCIPI
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