| 摘要 |
PROBLEM TO BE SOLVED: To form a positioning marker for image recognition of structure contributing to miniaturization of a bonding substrate at a metal-ceramic bonding substrate. SOLUTION: A metal layer 3 of≥0.2 mm thickness (t) is formed on at least one surface of a ceramic substrate 2. As the positioning marker, a not-penetrating recess is formed on the surface of the metal layer by milling work. Regarding the recess, a depth (d) is≥0.15 mm, the diameter (a) of an opening part at the surface of the metal layer is≤1.5 mm, a difference between the diameter (a) of the opening at the surface of the metal layer and the diameter (b) of a bottom is≤0.20 mm, and the thickness (c) of the metal layer of the bottom of the recess is≥0.05 mm. COPYRIGHT: (C)2006,JPO&NCIPI
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