| 摘要 |
PROBLEM TO BE SOLVED: To improve a productivity for an article to be plated, enable the article to be mass-produced, and simultaneously obtain a plated film with no pin hole, high hardness, high abrasion resistance, uniform thickness and high corrosion resistance. SOLUTION: The plating method comprises plating the article 2 by electrochemically reacting the article 2 with a surface treatment fluid, while circulating the surface treatment fluid in a circuit 8 containing a reaction tank 1 which accommodates the article 2 therein, wherein the surface treatment fluid is the fluid in an emulsion state containing at least an electrolyte 35, a surface active agent 40, and carbon dioxide 27 in a supercritical or subcritical state, and is circulated at a flow rate of 30 cm/sec or higher in the circuit 8. The plated article is obtained through the plating method. COPYRIGHT: (C)2006,JPO&NCIPI
|
