| 摘要 |
PROBLEM TO BE SOLVED: To provide a leadless high-temperature solder material which is high in the reliability of joining strength and enables soldering in a high-temperature region of 250 to 350°C. SOLUTION: The solder material of a melting point 250 to 300°C is composed of an alloy of a composition existing within a region enclosed by straight lines connecting points A (5.5wt% Ag, 29.5wt% Sn, 65wt% Bi), B (3.0wt% Ag, 7.0wt% Sn, 90wt% Bi), C (2.0wt% Ag, 8.0wt% Sn, 90wt% Bi), and D (3.0wt% Ag, 32wt% Sn, 65wt% Bi) in a ternary composition diagram of Ag, Sn and Bi and the solder material of the melting point 300 to 350°C is composed of the alloy of the composition existing within the region enclosed by the straight lines connecting the points A, B, E(5.5wt% Ag, 4.5wt% Sn, 90wt% Bi) and F(12wt% Ag, 23wt% Sn, 65wt% Bi). COPYRIGHT: (C)2006,JPO&NCIPI
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