| 发明名称 |
SEMICONDUCTOR PACKAGE HAVING STEP TYPE DIE AND MANUFACTURING METHOD OF THE SAME |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package having a step type die. <P>SOLUTION: A semiconductor die has a maximum width W<SB>0</SB>, a maximum length L<SB>0</SB>, and a first recessed part R<SB>I</SB>, wherein W<SB>0</SB>is reduced by a first recessed depth D<SB>rla</SB>to form a width W<SB>la</SB>of a first minor axis and L<SB>0</SB>is reduced by a first recessed length L<SB>rla</SB>to form a length L<SB>la</SB>of the first minor axis. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
| 申请公布号 |
JP2005294842(A) |
申请公布日期 |
2005.10.20 |
| 申请号 |
JP20050103706 |
申请日期 |
2005.03.31 |
| 申请人 |
SAMSUNG ELECTRONICS CO LTD |
发明人 |
KANG IN-KU;KIM JIN-HO;CHUNG TAE-GYEONG;KO SHAKU;LEE YONG-JAE |
| 分类号 |
H01L25/18;H01L21/301;H01L21/50;H01L21/60;H01L21/78;H01L21/98;H01L23/02;H01L23/12;H01L23/31;H01L25/065;H01L25/07;H01L29/06 |
主分类号 |
H01L25/18 |
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