| 摘要 |
PROBLEM TO BE SOLVED: To provide a high frequency module which can expect a high isolation effect with a low cost. SOLUTION: In the high frequency module, a region 1 on which a semiconductor chip is to be mounted is provided on a surface of a metallic module casing 3. In the region 1, a recess region 2 of a rectangular parallelopiped shape is provided and an edge region 4 is left. The recessed region 2 is obtained by cutting the metallic module casing 3 or by another method to remove part thereof. The semiconductor chip is mounted into the region 1 of a structure having the recessed region having air or a dielectric material filled therein. The region having the recessed and projected parts of the semiconductor chip has a part connected with the surface of the casing 3 and a part not connected therewith. COPYRIGHT: (C)2006,JPO&NCIPI
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