| 摘要 |
PROBLEM TO BE SOLVED: To provide an electroless nickel (alloy) plating bath capable of achieving satisfactory formation of a plating film and satisfactory continuous use of the plating bath without substantially incorporating lead etc., which are hazardous substances therein. SOLUTION: The electroless nickel plating bath contains a water-soluble nickel salt, a reducing agent, molybdenum, and bismuth and the electroless nickel (alloy) plating bath contains further an alloying metal salt in addition thereto. COPYRIGHT: (C)2006,JPO&NCIPI
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