| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for semiconductor encapsulation, excellent in moisture resistance without deteriorating curability, heat dissipation property and other characteristics, and to provide a semiconductor device using it. SOLUTION: By using the epoxy resin composition comprising an epoxy resin (A), a phenol resin (B), a curing accelerator (C), and a spherical alumina (D) having a specific crystalline structure in a specific ratio or more, the effect of improving moisture resistance is obtained. Further, since conditioning the particle distribution of the spherical alumina and the spherical silica enables the high loading of the inorganic fillers, the effect of improving soldering resistance is also obtained. COPYRIGHT: (C)2006,JPO&NCIPI
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