| 摘要 |
PROBLEM TO BE SOLVED: To provide a metal-ceramics joining member of high reliability capable of preventing the occurrence of a solder crack or the damage of a chip even if a heat cycle is repeatedly applied. SOLUTION: In the metal-ceramics joining member wherein a metal member comprising aluminum or an aluminum alloy is joined to a ceramics member, electrolytic nickel plating with a thickness of 1-15μm, preferably 1.5-15μm, further preferably 2-10μm is applied to the whole surface or partial face of the metal member. A chip part or a radiation plate is soldered to the electrolytic nickel plating layer by solder not substantially containing lead. COPYRIGHT: (C)2006,JPO&NCIPI
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