Plating of multi-layer structures

摘要

An insulating layer ( 5 ) and a conductive seed layer ( 6 ) are applied to a substrate ( 1 ) in a simple process. A photo resist with palladium chloride are provided in a bath for electrophoretic deposition onto the substrate. The photo resist is an insulator and the palladium chloride is a catalyst. The layer is heated with UV to cure it. The layer is plasma etched to expose more of the palladium chloride, which acts as a catalyst for electrodes plating of the conductive seed layer. A thicker conductive layer ( 7 ) is then electroplated onto the seed layer. These steps may be repeated for successive insulating and/or conductive layers.