发明名称 |
Semiconductor packaging substrate and method of producing the same |
摘要 |
A semiconductor packaging substrate and a process for producing the same is disclosed. An internal circuit is formed by lamination. Then, external circuit is formed on the internal circuit by build-up technology. The substrate can be used as a flip-chip ball grid array packaging substrate with high density and small pitch. Furthermore, the substrate of the invention has a plurality of bonding pads thereon. The bump pads are divided into power/ground bump pads, first signal bump pads, and second signal bump pads. The first signal bump pads surround the power/ground bump pads and are surrounded by the second signal bump pads.
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申请公布号 |
US2005230814(A1) |
申请公布日期 |
2005.10.20 |
申请号 |
US20050155229 |
申请日期 |
2005.06.16 |
申请人 |
HSU CHI-HSING;CHANG WEN-YUAN |
发明人 |
HSU CHI-HSING;CHANG WEN-YUAN |
分类号 |
H01L23/498;H05K1/11;H05K3/46;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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