| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a CMP device capable of in-situ monitoring for smoothly and highly accurately performing an optical measurement of a polishing surface when polishing a substrate to be polished by an overhang system. <P>SOLUTION: This CMP polishing device is provided with a substrate holding mechanism and a polishing table stuck with a polishing pad, and polishes the substrate to be polished by relatively moving the polishing table and the substrate to be polished in an interposed state of polishing liquid. In an in-situ monitoring device in the CMP polishing device, the substrate to be polished is overhung to be extended from the polishing table to the surrounding, and notch sensor and image recognition optical head arranged on a side part of the polishing table stuck with the polishing pad are arranged. In the CMP in-situ monitoring device, a pure water supply pipe for washing the polishing surface with pure water is provided at a position where the polishing surface of the substrate to be polished is notch-sensed and recognized in image, and a dewatering mechanism for removing the washing water by suction is provided in the vicinities of the notch sensor and the image recognition optical head. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
