| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable light receiving integrated circuit device capable of being made to be lead-free without impairing the quality of a bonding material. SOLUTION: The light receiving integrated circuit device is so configured that a light receiving integrated circuit 4 and a chip capacitor 6 are mounted on a circuit board 2 and are sealed with a transparent resin 8. The light receiving integrated circuit 4 is die-bonded to a conductive pattern 2b with an Au paste 10. The electrode 6a of the chip capacitor 6 is connected to the conductive pattern 2b with an Au paste 12. The electrode of the chip capacitor 6 is formed with Au plating. Consequently, the device can be fixed/connected quite without the use of a solder to completely achieve lead-free characteristic. Further, there is caused no quality deterioration like Ag-based conductive paste and an Ag plated electrode to raise reliability. COPYRIGHT: (C)2006,JPO&NCIPI
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