发明名称 |
Method for cleaning the surface of a substrate |
摘要 |
A cleaning process for cleaning the surface of a substrate is disclosed, wherein the surface comprises portions of a dielectric material and portions of a conductive material. According to the method disclosed, the temperature at the surface of the substrate is kept below a predefined value during the actual cleaning step in a reactive and/or inert plasma ambient, such as an argon gas ambient, wherein the predefined value corresponds to the surface temperature at which agglomeration of the conductive material occurs.
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申请公布号 |
US2005230344(A1) |
申请公布日期 |
2005.10.20 |
申请号 |
US20050072139 |
申请日期 |
2005.03.04 |
申请人 |
KOSCHINSKY FRANK;KAHLERT VOLKER;HUEBLER PETER |
发明人 |
KOSCHINSKY FRANK;KAHLERT VOLKER;HUEBLER PETER |
分类号 |
H01L21/02;H01L21/283;H01L21/302;H01L21/768;(IPC1-7):H01L21/302 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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