发明名称 THERMOPLASTIC RESIN COMPOSITION AMD MOLDINGS THEREOF
摘要 <p>Moldings of a thermoplastic resin containing a layer compound microdispersed therein, which are improved in the balance among physical properties by virtue of the microdispersed layer compound; and a thermoplastic resin composition capable of giving the moldings. Namely, a thermoplastic resin composition comprising a thermoplastic resin and a layer compound treated with a nonionic compound. The nonionic compound is one which has the property of being dissolved or dispersed in water or the like at 23&ring;C and the mixture of which with water or the like has the property of taking a two-layer separate state at a temperature within the range of 40 to 80&ring;C.</p>
申请公布号 WO2005097904(A1) 申请公布日期 2005.10.20
申请号 WO2005JP04901 申请日期 2005.03.18
申请人 KANEKA CORPORATION;KOBAYASHI, MARIKO;YONEMUSHI, YOSHIHARU;YOSHIDA, TATSUSHI 发明人 KOBAYASHI, MARIKO;YONEMUSHI, YOSHIHARU;YOSHIDA, TATSUSHI
分类号 C08K9/04;C08L101/00;(IPC1-7):C08L101/00 主分类号 C08K9/04
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