发明名称 |
THERMOPLASTIC RESIN COMPOSITION AMD MOLDINGS THEREOF |
摘要 |
<p>Moldings of a thermoplastic resin containing a layer compound microdispersed therein, which are improved in the balance among physical properties by virtue of the microdispersed layer compound; and a thermoplastic resin composition capable of giving the moldings. Namely, a thermoplastic resin composition comprising a thermoplastic resin and a layer compound treated with a nonionic compound. The nonionic compound is one which has the property of being dissolved or dispersed in water or the like at 23˚C and the mixture of which with water or the like has the property of taking a two-layer separate state at a temperature within the range of 40 to 80˚C.</p> |
申请公布号 |
WO2005097904(A1) |
申请公布日期 |
2005.10.20 |
申请号 |
WO2005JP04901 |
申请日期 |
2005.03.18 |
申请人 |
KANEKA CORPORATION;KOBAYASHI, MARIKO;YONEMUSHI, YOSHIHARU;YOSHIDA, TATSUSHI |
发明人 |
KOBAYASHI, MARIKO;YONEMUSHI, YOSHIHARU;YOSHIDA, TATSUSHI |
分类号 |
C08K9/04;C08L101/00;(IPC1-7):C08L101/00 |
主分类号 |
C08K9/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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