| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of impressing required voltages without changing the arrangement of BGA substrate external connection terminals, on the peripheral locations of a semiconductor chip with its memory augmented. <P>SOLUTION: The semiconductor device has a semiconductor chip 10, and a substrate 20 for mounting the semiconductor chip 10. The substrate 20 has a first electrode pad 11 dividing the semiconductor chip 10 into a first and second chip regions 12a and 12b; a pair of first and second electrode pads 13 and 14 installed in the two chip regions 12a and 12b; and a linking section 22 linking a central opening 21 on the boundary between a first and second substrate regions 23a and 23b, the peripheral openings 24 and 25 of a first and second substrate regions 23a and 23b, and the two substrate regions 23a an 23b. The substrate 20 has also first through third connection pads 33, 36, and 37 on the brims of the central and peripheral openings 21, 24, and 25. Furthermore, the substrate has electrical means for connecting the external connection terminal 32a, a first connection pad 33, and a second connection pad 36a; the external connection pad 32b, the first connection pad 33, and the third connection pad 37b; the third connection pad 37a and the external connection terminal 32a via the linking section 22; and the second connection pad 36b and the external connection terminal 32b via the linking section 22, respectively. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
