| 摘要 |
PROBLEM TO BE SOLVED: To provide a chip component which has good solder wettability and causes no chip standing phenomenon. SOLUTION: An electronic component has an external electrode solder to an external electric circuit on the surface of an electronic component raw body, and the external electrode is formed by laminating a 1st plating layer containing at least tin and a 2nd plating layer made of tin alloy having a lower fusion point than the 1st plating layer on the surface of a ground conductor layer so that the 2nd plating layer is outside the 1st plating layer. The ground conductor layer is formed by Ni plating, and the thickness of the 2nd plating layer is set to 0.01 to 0.05μm. COPYRIGHT: (C)2006,JPO&NCIPI
|
