发明名称 |
MANUFACTURING METHOD OF CERAMIC ELECTRONIC COMPONENT |
摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic electronic component with the less variation of electrostatic capacity improved in transfer accuracy at the time of transferring a metal thin film onto a ceramic sheet from a supporter, and having stable electric characteristics by improving a junction of interfaces of ceramic and an internal electrode. SOLUTION: The method comprises a first process of forming a resin layer on at least one of an upper surface and a lower surface of the ceramic sheet; a second process of providing a ceramic layer on a part other than a predetermined pattern corresponding to the internal electrode on one resin layer formed on the ceramic sheet; a third process of overlapping the metal thin film together with its supporter such that the ceramic layer provided on the resin layer formed on the ceramic sheet and the metal thin film formed on the supporter are opposed to each other; a fourth process of exfoliating the supporter and transferring the metal thin film to a predetermined pattern shape corresponding to the internal electrode to a part other than the ceramic layer provided on the resin layer formed on the ceramic sheet; a fifth process of manufacturing a laminate by laminating the ceramic sheet having the resin layer manufactured in the fourth process, the ceramic layer, and the metal thin film by a predetermined number; and a sixth process of cutting and calcining the laminate thereafter. COPYRIGHT: (C)2006,JPO&NCIPI
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申请公布号 |
JP2005294345(A) |
申请公布日期 |
2005.10.20 |
申请号 |
JP20040103776 |
申请日期 |
2004.03.31 |
申请人 |
MATSUSHITA ELECTRIC IND CO LTD |
发明人 |
NAKAMURA KENGO;TSUJIMURA TAKAHIKO;ABE FUYUKI;NAGAI ATSUO |
分类号 |
H01G4/12;H01G4/30;(IPC1-7):H01G4/12 |
主分类号 |
H01G4/12 |
代理机构 |
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地址 |
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