发明名称 |
Method of manufacturing multi-stack package |
摘要 |
A method of manufacturing a multi-stack package that ensures easy application of a solder paste or a flux. The method includes forming a first package comprising a first substrate on which bumps are arranged and a second package comprising a second substrate on which electrode pads corresponding to the bumps are arranged, applying a solder paste on the bumps of the first package, and electrically connecting the bumps of the first package and the electrode pads of the second package.
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申请公布号 |
US2005233567(A1) |
申请公布日期 |
2005.10.20 |
申请号 |
US20050053599 |
申请日期 |
2005.02.07 |
申请人 |
KIM SE-NYUN;KWON HEUNG-KYU;YOON KI-MYUNG |
发明人 |
KIM SE-NYUN;KWON HEUNG-KYU;YOON KI-MYUNG |
分类号 |
H01L25/18;H01L21/44;H01L21/52;H01L21/60;H01L21/98;H01L23/12;H01L23/498;H01L25/10;H01L25/11;H05K3/34;(IPC1-7):H01L21/44 |
主分类号 |
H01L25/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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