发明名称 |
Methods for making semiconductor packages with leadframe grid arrays |
摘要 |
Methods of forming a semiconductor assembly are described which include a leadframe with leads having offset portions exposed at an outer surface of a material package to form a grid array. An electrically conductive compound, such as solder, may be disposed or formed on the exposed lead portions to form a grid array such as a ball grid array ("BGA") or other similar array-type structure of dielectric conductive elements. The leads may have inner bond ends including a contact pad thermocompressively bonded to a bond pad of the semiconductor chip to enable electrical communication therewith and a lead section with increased flexibility to improve the thermocompressive bond. The inner bond ends may also be wirebonded to the bond pads.
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申请公布号 |
US2005230808(A1) |
申请公布日期 |
2005.10.20 |
申请号 |
US20050153952 |
申请日期 |
2005.06.16 |
申请人 |
YU CHAN M;LENG SER B;WAF LOW S;POO CHIA Y;KOON ENG M |
发明人 |
YU CHAN M.;LENG SER B.;WAF LOW S.;POO CHIA Y.;KOON ENG M. |
分类号 |
H01L21/56;H01L21/60;H01L23/31;H01L23/48;H01L23/495;(IPC1-7):H01L23/495 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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