发明名称 |
Direct tunneling memory with separated transistor and tunnel areas |
摘要 |
A semiconductor device has: an isolation region formed on a semiconductor substrate and defining a continuous active region including a select transistor region and a direct tunnel element region; a gate insulating film formed on a channel region of the select transistor region; a tunnel insulating film formed on a partial area of the direct tunnel element region and having a thickness different from a thickness of the gate insulating film; a continuous floating gate electrode formed above the gate insulating film and the tunnel insulating film; an inter-electrode insulating film formed on a surface of the floating gate electrode; a control gate electrode facing the floating gate electrode via the inter-electrode insulating film; and a pair of source/drain regions formed on both sides of the channel region of the select transistor region and not overlapping the tunnel insulating film.
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申请公布号 |
US2005230741(A1) |
申请公布日期 |
2005.10.20 |
申请号 |
US20050037176 |
申请日期 |
2005.01.19 |
申请人 |
FUJITSU LIMITED |
发明人 |
TSUNODA KOUJI;USUKI TATSUYA;TAGUCHI MASAO |
分类号 |
H01L21/8247;G11C16/04;H01L27/105;H01L27/115;H01L29/06;H01L29/788;H01L29/792;(IPC1-7):H01L29/788 |
主分类号 |
H01L21/8247 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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