发明名称 Direct tunneling memory with separated transistor and tunnel areas
摘要 A semiconductor device has: an isolation region formed on a semiconductor substrate and defining a continuous active region including a select transistor region and a direct tunnel element region; a gate insulating film formed on a channel region of the select transistor region; a tunnel insulating film formed on a partial area of the direct tunnel element region and having a thickness different from a thickness of the gate insulating film; a continuous floating gate electrode formed above the gate insulating film and the tunnel insulating film; an inter-electrode insulating film formed on a surface of the floating gate electrode; a control gate electrode facing the floating gate electrode via the inter-electrode insulating film; and a pair of source/drain regions formed on both sides of the channel region of the select transistor region and not overlapping the tunnel insulating film.
申请公布号 US2005230741(A1) 申请公布日期 2005.10.20
申请号 US20050037176 申请日期 2005.01.19
申请人 FUJITSU LIMITED 发明人 TSUNODA KOUJI;USUKI TATSUYA;TAGUCHI MASAO
分类号 H01L21/8247;G11C16/04;H01L27/105;H01L27/115;H01L29/06;H01L29/788;H01L29/792;(IPC1-7):H01L29/788 主分类号 H01L21/8247
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