发明名称 Conductive elements with adjacent, mutually adhered regions and semiconductor device assemblies including such conductive elements
摘要 Conductive elements that include a plurality of adjacent, mutually adhered regions are disclosed. All of the regions may include the same type of material. At least a portion of such a conductive element may be configured to extend laterally. In a semiconductor device assembly, such a conductive element is in electrical communication with a contact of at least one semiconductor device component, and may extend between corresponding contacts of two or more semiconductor device components.
申请公布号 US2005230806(A1) 申请公布日期 2005.10.20
申请号 US20050140823 申请日期 2005.05.31
申请人 WILLIAMS VERNON M 发明人 WILLIAMS VERNON M.
分类号 H01L21/60;H01L23/495;H01L25/065;H05K3/02;(IPC1-7):H01L29/76 主分类号 H01L21/60
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