| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable semiconductor device, its manufacturing method, and electronic equipment. <P>SOLUTION: The semiconductor device is provided with a base substrate 10, a first semiconductor chip 20 mounted on the base substrate 10 so that its surface on the opposite side of the surface provided with first pads 24 may be faced to the substrate 10, and an insulating section 30 formed beside the first semiconductor chip 20. The device is also provided with wiring 40 which is formed to pass over the insulating section 30 in a state where the wiring 40 is electrically connected to one of the first pads 24, a second semiconductor chip 50 mounted on the first semiconductor chip 20 so that second pads 54 may be faced respectively to the first pads 24, and conductive sections 60 which are positioned between the first and second pads 24 and 54 to electrically connect the pads 24 and 54 to each other. The second semiconductor chip 50 is mounted on the first semiconductor chip 20 to cover all first pads 24. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
