PRINTED-CIRCUIT BOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a low cost printed-circuit board by bonding a conductive pattern with a metal foil pattern using a low cost insulating adhesive. SOLUTION: A printed-circuit board 1 comprises a plurality of conductive pattern 3 formed on an insulating substrate 2 and a plurality of metal foil pattern 5 connected to this plurality of the conductive pattern 3 respectively, and the conductive patterns 3 and the metal foil patterns 5 are electrically connected respectively in such a way that they are bonded with an insulating adhesive 4 locating between adjacent conductive patterns 3 and between adjacent metal foil patterns 5. COPYRIGHT: (C)2006,JPO&NCIPI