发明名称 METHOD AND DEVICE FOR ARRAYING AND LOADING CONDUCTIVE BALL
摘要 PROBLEM TO BE SOLVED: To provide a method and a device for arraying and loading a conductive ball, in which a defective attraction is difficult to occur and which can array the conductive ball efficiently. SOLUTION: The conductive balls B in a vessel are attracted and arrayed on an array plate 19, and loaded collectively to an electrode for a wafer W, on which the balls B must be loaded. When the conductive balls B are loaded on the electrode, a spacer 20 is abutted against the periphery of the array plate 19. Either one or both of the contamination of the array plate 19 or an unbalanced load to the conductive balls B are prevented by the spacer 20. The spacer 20 is abutted against a part or the whole of the periphery of the array plate 19. A defective ball loading is prevented, and the conductive balls can be arrayed properly and efficiently. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005294490(A) 申请公布日期 2005.10.20
申请号 JP20040106747 申请日期 2004.03.31
申请人 NIPPON STEEL CORP 发明人 HASHINO HIDEJI;ISHIKAWA SHINJI;KONO TARO
分类号 H01L21/60;(IPC1-7):H01L21/60 主分类号 H01L21/60
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