| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for easily connecting a bus bar to a conductive member, and to provide the bus bar. SOLUTION: Terminal sections 12a, 12b, and 12c have retention sections 21a, 21b, 21c, 21d, and 21e, 12f. In the retention sections, and the clearance of the retention sections to an opposite retention section becomes narrower toward the tip side. For example, in the case of the retention sections 21a, 21b, the clearance between tip sections 22a, 22b is the same as or is narrower than the diameter of a lead 31a. With the connection to a semiconductor device 30, the lead 31a is passed through a through hole 26a at a substrate section 25 toward the retention sections 21a, 21b. When a mold resin 32 in the semiconductor device 30 comes into contact with a spacer 42, the lead 31a is sandwiched by the tip sections 22a, 22b. In this state, welding is made. COPYRIGHT: (C)2006,JPO&NCIPI
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