| 摘要 |
Blackened layers 23 A and 23 B are formed by depositing Cu-Co alloy particles on the surfaces of a metal layer 21 . The metal layer 21 coated with the blackened layers 23 A and 23 B of the Cu-Co alloy particles is subjected to a chromating process to form density-intensifying layers 25 A and 25 B on the blackened layers 23 A and 23 B. A base 11 is laminated to the density-intensifying layer 25 A or 25 B. A conductive structure 109 consisting of the meal layer 21 , the blackened layers 23 A and 23 B, and the density-intensifying layers 25 A and 25 B is processed by a photolithographic process to complete an electromagnetic shielding sheet 1 having a mesh conductive structure.
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