INTEGRATED RADIO FRONT-END MODULE WITH EMBEDDED CIRCUIT ELEMENTS

摘要

A highly integrated radio front-end module. In one embodiment a semiconductor substrate is processed with various circuit components in the substrate, as well as interconnections for the various circuit components, imbedding the circuit components into the substrate. One or more circuit components may be further connected with a separate integrated circuit, the separate integrated circuit bonded to the semiconductor substrate via contact points processed into the substrate.