| 摘要 |
<P>PROBLEM TO BE SOLVED: To attain thinning, miniaturization, and increase of pins of a semiconductor device at low cost, by using an inexpensive lead frame and making a die pad unnecessary, and to improve connection reliability and sealing stability as well as mounting reliability and stability, by fixing semiconductor elements. <P>SOLUTION: The device (semiconductor package) 20 is realized in such a way that the wire bonding of a terminal (external terminal) 5 formed of a lead frame 24 and a semiconductor device (IC chip) 1 is carried out by a wire 4 sealed with a sealing resin 7, an insulating resin layer 21 is beforehand formed by coating or the like in contact with the rear face of the semiconductor device 1, and the insulating resin layer 21 is exposed to the rear face side of the sealing resin 7. The device exists on the same flat surface as the rear face of the terminal 5. <P>COPYRIGHT: (C)2006,JPO&NCIPI |
