| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a crosslinkable resin composition that has excellent dissolution stability, in addition, gives resin film having uniform film thickness, flattened uneven parts, thermally resistant shape retention properties and excellent dielectric characteristics on the substrate and is suitable for electronic parts, for example, integrated circuit device, liquid crystal display, solid-state image sensing device, and provide a laminate body on the substrate by using the crosslinking resin composition and the method for producing this laminate. <P>SOLUTION: This is a crosslinkable resin composition comprising a ring olefin polymer bearing a protonic polar group, a crosslinking agent and a solvent in which the solvent comprises a mixture of a monoalkylene glycol compound and an oligoalkylene glycol compound where the weight ratio of the monoalkylene glycol to the oligoalkylene glycol is 10/90 to 50/50. Further, the laminate comprising a substrate and a resin film that is formed by using this crosslinking resin composition is provided. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
