| 摘要 |
PROBLEM TO BE SOLVED: To provide the cooling device of a soldered printed circuit board whose cooling condition can be changed. SOLUTION: The cooling device of the soldered printed circuit board is provided with a cooling means for cooling the printed circuit board by discharging a cooling medium toward the printed circuit board to contact with the printed circuit board, and a transferring means for moving the printed circuit board relatively with respect to the cooling means so as to be cooled by the cooling means. The discharging direction of the cooling medium can be changed to two or more different directions. Otherwise, the printed circuit board is soldered at a transferring path where the board is transferred relatively with respect to the cooling means by the transferring means. A distance between a soldered point and a cooling start point can be changed. COPYRIGHT: (C)2006,JPO&NCIPI |
