摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipation module capable of enhancing heat dissipation efficiency effectively. SOLUTION: A heat dissipation module, comprising: an air conveying device 10, and a cooling chamber having an air inlet and air vent; wherein the inside wall surface of the cooling chamber is formed with a heat transfer enhancing structure, and its outside wall surface is in contact with a heating element 28, and further the air conveying device draws airflow into and out of the cooling chamber, and the heat transfer enhancing structure defines a passage along which the airflow propagates in the cooling chamber. COPYRIGHT: (C)2006,JPO&NCIPI |