发明名称 HEAT DISSIPATION MODULE
摘要 PROBLEM TO BE SOLVED: To provide a heat dissipation module capable of enhancing heat dissipation efficiency effectively. SOLUTION: A heat dissipation module, comprising: an air conveying device 10, and a cooling chamber having an air inlet and air vent; wherein the inside wall surface of the cooling chamber is formed with a heat transfer enhancing structure, and its outside wall surface is in contact with a heating element 28, and further the air conveying device draws airflow into and out of the cooling chamber, and the heat transfer enhancing structure defines a passage along which the airflow propagates in the cooling chamber. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005294802(A) 申请公布日期 2005.10.20
申请号 JP20040362555 申请日期 2004.12.15
申请人 TAIDA ELECTRONIC IND CO LTD 发明人 LEE YI-SHENG;TAN LI-KUANG
分类号 H01L23/467;H05K7/20;(IPC1-7):H01L23/467 主分类号 H01L23/467
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