发明名称 CONDUCTIVE SILVER PASTE AND ELECTROMAGNETIC WAVE SHIELDING MEMBER USING IT
摘要 PROBLEM TO BE SOLVED: To provide a conductive silver paste which is most suitable for forming a circuit-made minute and can form a circuit, having a better conductivity than the conventional conductive silver paste, and to provide an electromagnetic wave shielding member using the same. SOLUTION: This is the conductive paste, containing a silver powder, a binder resin, and a solvent, and the silver powder, is made principally of a silver particle (A), having an average particle size of 0.5 to 20μm and a spherical silver particle (B), having an average particle size of primary particle of 50 nm or smaller and its mixing ratio is in the range (A):(B)= 99:1-80:20. The circuit, using this conductive paste, has proper conductivity, even if the circuit is made minute and is superior in adhesion and has superior electromagnetic wave shielding characteristics. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005294254(A) 申请公布日期 2005.10.20
申请号 JP20050058488 申请日期 2005.03.03
申请人 SUMITOMO ELECTRIC IND LTD 发明人 KASUGA TAKASHI;SHIMODA KOHEI;YAMAKAWA SHINKO;OZOEGAWA MISAKO
分类号 H05K1/09;H01B1/00;H01B1/22;H05K9/00;(IPC1-7):H01B1/22 主分类号 H05K1/09
代理机构 代理人
主权项
地址