发明名称 CURABLE COMPOSITION, SEALING MATERIAL AND ADHESIVE
摘要 PROBLEM TO BE SOLVED: To provide a moisture-curable composition which has elasticity and a shortened curing time, to provide a sealing material, and to provide an adhesive. SOLUTION: This curable composition comprises (a) a vinylic polymer having cross-linkable silyl groups represented by formula (1): -[Si(R<SP>1</SP>)<SB>2-b</SB>(Y)<SB>b</SB>O]<SB>m</SB>-Si(R<SP>2</SP>)<SB>3-a</SB>(Y)<SB>a</SB>[R<SP>1</SP>and R<SP>2</SP>are each an alkyl, an aryl, an aralkyl, or the like; Y is OH or a hydrolyzable group; (a) is 0 to 3; (b) is 0 to 2; (m) is an integer of 0 to 19, where (a)+(m)(b)≥1], at the terminals, and having a number-average mol.wt. of 3,000 to 100,000 and a glass transition temperature of 20 to 150°C, and has a dynamic viscoelasticity (application frequency: 10 Hz, strain: 1%) storage elastic modulus characteristic E' of≤105 Pa at temperature of 50 to 200°C and≥106 Pa in a temperature region of≤50°C. The curable composition can also be used as a hot melt adhesive or a sealing material. COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005290273(A) 申请公布日期 2005.10.20
申请号 JP20040109524 申请日期 2004.04.01
申请人 SEKISUI CHEM CO LTD 发明人 FUKUI KOJI;SHIMOMURA YORIKO
分类号 C09K3/10;C08K3/34;C08L71/02;C08L101/10;C09J201/10;(IPC1-7):C08L101/10 主分类号 C09K3/10
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