| 摘要 |
PROBLEM TO BE SOLVED: To obtain an oxetane resin composition suitable for an encapsulating resin for an optical semiconductor device (LED (light emitting diode)) capable of providing an improved coloration of a hardened resin and that due to heat history. SOLUTION: This oxetane resin composition comprises at least one oxetane resin (A) of 100 pts.wt. selected from an aliphatic oxetane resin , a cycloaliphatic oxetane resin and a silicon containing oxetane resin, a cationic initiator (B) of 0.01-15 pts.wt., a phenolic antioxidant (C) of 0.001-5 pts.wt. and a phosphorus compound (D) of 0.001-5 pts.wt. COPYRIGHT: (C)2006,JPO&NCIPI
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