发明名称 |
Electronic component, mounted structure, electro-optical device, and electronic device |
摘要 |
An electronic component electrically connected to a counter substrate through a pad on an active surface, characterized in that a resin bump on the active surface and an electrically conductive film on the resin bump constitute a bump electrode, and that a plurality of bump electrodes are electrically connected to the one pad.
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申请公布号 |
US2005230773(A1) |
申请公布日期 |
2005.10.20 |
申请号 |
US20050103412 |
申请日期 |
2005.04.11 |
申请人 |
SAITO ATSUSHI;TANAKA SHUICHI |
发明人 |
SAITO ATSUSHI;TANAKA SHUICHI |
分类号 |
H01L23/12;H01L21/60;H01L23/485;(IPC1-7):H01L31/020 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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