发明名称 High performance system-on-chip discrete components using post passivation process
摘要 A system and method for forming post passivation discrete components, is described. High quality discrete components are formed on a layer of passivation, or on a thick layer of polymer over a passivation layer.
申请公布号 US2005230783(A1) 申请公布日期 2005.10.20
申请号 US20050062276 申请日期 2005.02.18
申请人 MEGIC CORPORATION 发明人 LIN MOU S.
分类号 H01L21/02;H01L21/768;H01L23/522;H01L23/528;H01L23/532;H01L23/60;H01L23/64;H01L27/06;H01L27/08;(IPC1-7):H01L23/48 主分类号 H01L21/02
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