INDUCTOR COIL FOR AN IC CHIP

摘要

A coil comprises a layer of permeable material (4) deposited in a chip (CH) of an integrated circuit (IC) in a plane substantially parallel to a surface (A) of a substrate (1) of the chip (CH). A first conductor element (6a, 6b; BW10, BWI 1; 60a, 60b) is arranged at a first side of the permeable material (4) facing away from the substrate (1). A second conductor element (2a, 2b; T1, T2) is arranged at a second side of the permeable material (4) opposite to the first side. An interconnection (8a, 8b; P2, P4) interconnects a first end of the first conductor element (6a, 6b; BW10, BWI 1; 60a, 60b) and a first end of the second conductor element (2a, 2b; TI, T2). The interconnection (8a, 8b; P2, P4), the first conductor element (6a, 6b; BW10, BW11; 60a, 60b) and the second conductor element (2a, 2b; TI, T2) are arranged to form a winding around the permeable material (4). The winding extends in a plane substantially perpendicular to the surface (A) of the substrate (1) to conduct current (I) in a plane substantially perpendicular to the surface (A) of the substrate (1).