| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electronic component that suppresses the generation of cracks in constrictions of solder bumps by improving the flexibility of the solder bumps, does not cause a disconnection defect even when cracks are generated, and can prevent the breakage of the solder bumps, and to provide an electronic device. <P>SOLUTION: In the electronic component, first and second substrates are arranged to face each other. The solder bumps 23 are formed between a plurality of first conductive sections 21a arranged on one surface (first insulating section 20) having an insulating property of the first substrate, and a plurality of second conductive sections 32 arranged on one surface (third insulating section 30) having an electrical insulating property of the second substrate. In at least one solder bump 23, one surface of the first conductive section 21a which is in contact with the solder bump 23 is formed with an outer peripheral section coated with an insulating layer (second insulating section 22), and an inner peripheral section formed with a projecting section 24 which is arranged in contact with the first conductive section 21a. The projecting sections 24 are composed of members having higher flexibility than the solder bumps 23 have. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
