| 摘要 |
PROBLEM TO BE SOLVED: To improve plating property for a conductive pattern by removing glass constituent lifted on a conductive pattern on the surface of a substrate accompanying the calcination of a low-temperature calcination ceramic substrate while avoiding damage on the substrate due to chemical treatment. SOLUTION: The manufacturing method of the low-temperature calcination ceramic substrate comprises a process for forming a conductive pattern on the surface of the low-temperature calcination ceramic substrate, a process for calcining the low-temperature calcination ceramic substrate, and a process for applying plating on the conductive pattern while blasting treatment is applied on the surface of the low-temperature calcination ceramic substrate forming the conductor pattern before the plating process. The blasting treatment is wet blast and the grain size of polishing material is specified so as to be less than 100μm. COPYRIGHT: (C)2006,JPO&NCIPI |
