| 摘要 |
PROBLEM TO BE SOLVED: To control a BGA rise while exercising ingenuity for a layout of a screw fastening place and BGA mounting place to tolerate a wiring substrate's curvature deformation. SOLUTION: The ball grid array 2 is mounted on a wiring substrate 1, and a solder heaping part as a ground electrode is formed around a screw insertion hole 12. On the wiring substrate 1, a first rectangular zone Z1 surrounded by screw fastening places P1 to P4 and a second zone Z2 outside the first zone Z1 are formed in a partitioned way, and a ball grid array 2 is mounted at an intersection of a longitudinally traversing space S1 and a latitudinally traversing space S2 which both make up the second zone Z2. COPYRIGHT: (C)2006,JPO&NCIPI |
