发明名称 Semiconductor device
摘要 A semiconductor device includes a base insulation film formed on a semiconductor substrate via another layer, a metal thin-film resistance formed on the base insulation film, and a laser beam interruption film of a metal material interposed between the semiconductor substrate and the base insulation film.
申请公布号 US2005230833(A1) 申请公布日期 2005.10.20
申请号 US20050079315 申请日期 2005.03.15
申请人 KATO HIDENORI;MORI MASAHIDE 发明人 KATO HIDENORI;MORI MASAHIDE
分类号 H01L27/04;B21B1/00;B21C1/00;B21F1/00;H01C7/00;H01L21/822;H01L27/01;(IPC1-7):B21B1/00 主分类号 H01L27/04
代理机构 代理人
主权项
地址