SURFACE ACOUSTIC WAVE FILTER AND MANUFACTURING METHOD THEREOF

摘要

A surface acoustic wave filter for preventing a large void from being generated at the time of pressing a resin sheet covering an element chip while heating the resin sheet, and a method for manufacturing the surface acoustic wave filter. The element chip (10) is arranged so as to have one main plane (11a) of a piezoelectric board (11) face a mounting board (2). On the piezoelectric board, a wiring pattern including an IDT (14) and a pad (16) electrically connected to the IDT (14) are formed. The pad (16) is electrically connected to a land (3) of the mounting board (2) through bumps (4). A resin film (6) covers the other main plane (11b) of the piezoelectric board (11) and the other main plane of the mounting board (2) and seals the element chip (10). The piezoelectric board (11) has the relatively large one main plane (11a) and the relatively small the other main plane (11b).