CURING RESIN COMPOSITION, ADHESIVE EPOXY RESIN PASTE, ADHESIVE EPOXY RESIN SHEET, CONDUCTIVE CONNECTION PASTE, CONDUCTIVE CONNECTION SHEET, AND ELECTRONIC COMPONENT JOINED BODY

摘要

A curing resin composition which is excellent in mechanical strength, heat resistance, moisture resistance, flexibility, temperature cycle resistance, solder reflow resistance and dimensional stability after curing and exhibits high adhesion reliability and high conduction reliability is disclosed. An adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body respectively using such a curing resin composition are also disclosed. The curing resin composition contains an epoxy resin, a solid polymer having a functional group reactive with an epoxy group, and an epoxy resin curing agent. When a cured product of this curing resin composition is dyed with a heavy metal and observed with a transmission electron microscope, no phase separation structure is observed in the matrix resin.