发明名称 ELEMENT MOUNTING BOARD, ITS MANUFACTURING METHOD AND SEMICONDUCTOR DEVICE EMPLOYING IT
摘要 <P>PROBLEM TO BE SOLVED: To provide an element mounting board exhibiting excellent reliability and heat resistance stably. <P>SOLUTION: The manufacturing method of a board for mounting an element comprises a step for forming a multilayer film consisting of an insulating resin layer 312 and a photosolder resist film 328 containing cardo type polymer, respectively, on the opposite surfaces of a substrate 302. The step for forming each multilayer film comprises a step for forming a photosolder resist film 328 by bonding a material film containing cardo type polymer. <P>COPYRIGHT: (C)2006,JPO&NCIPI
申请公布号 JP2005294414(A) 申请公布日期 2005.10.20
申请号 JP20040105042 申请日期 2004.03.31
申请人 SANYO ELECTRIC CO LTD 发明人 USUI RYOSUKE;NAKAMURA TAKESHI
分类号 H05K3/46;H01L23/12 主分类号 H05K3/46
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