发明名称 FEATURES IN SUBSTRATES AND METHODS OF FORMING
摘要 The described embodiments relate to features (905) in substrates (300) and methods of forming same. One exemplary embodiment can be a microdevice that includes a substrate (300) extending between a first substrate surface (302) and a generally opposing second substrate surface (303), and at least one feature (905) formed into the first surface (302) along a bore axis that is not transverse to the first surface (302).
申请公布号 WO2005097506(A2) 申请公布日期 2005.10.20
申请号 WO2005US10430 申请日期 2005.03.29
申请人 HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;CLARKE, LEO, JR.;ASCHOFF, CHRIS;ADDINGTON, CARY G. 发明人 CLARKE, LEO, JR.;ASCHOFF, CHRIS;ADDINGTON, CARY G.
分类号 B41J2/14;B41J2/16 主分类号 B41J2/14
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