PURGING OF A WAFER CONVEYANCE CONTAINER

摘要

Embodiments of the invention are directed to methods and systems of purging of transfer containers, such as standardized mechanical interface (SMIF) pods. In particular, purified purge gases can purify front operated unified pods (FOUPs) and other non hermetically sealed transfer containers, such that the containers can be interfaced with a sealed chamber (e.g., a semiconductor processing tool) without detrimentally contaminating the environment of the sealed chamber with organics and other harmful contaminants. The methods and systems may be used to transfer objects, such as wafers, semiconductor components, and other materials requiring exposure to extremely clean environments, during electronic materials manufacturing and processing.