| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an electric insulation structure for forming an electric insulation layer which can be used for a circuit board such as a PCB, a chip carrier, or the like. <P>SOLUTION: The electric insulation layer contains a hardened resin material and a filler in the shape of particles of a specified wt.%, and does not contain continuous fiber, semi-continuous fiber, or the like. <P>COPYRIGHT: (C)2006,JPO&NCIPI</p> |
